ENC TECHNOLOGY

KOR ENG

Semiconductor

Vision inspection

A. Wire Bonding

It inspects the wire bonding quality of a multi-layered Chip PKG(consisting of 8 or more chips) with a height of
more than 3㎛ and judges whether it is defective

Feature

  • It can inspect PAD position, ball adhesion state and position to check whether the wire bonding between chips is properly connected to the PAD(the states of chips from the bottom PCB to the top)
  • It can inspect the wire height, thickness, and slop
  • It can determine whether the wires overlapped on the image are defective

B. PCB

It determines whether the PCB hole with a large area or wiring is defective or not.

Feature

  • After the holes are formed with a laser during the PCB manufacturing process, it checks a large amount of deep and small Via Holes with the diameter from several to tens of ㎛ and the depth about tens of ㎛
  • It checks the upper and lower diameters of the hole, the hole depth, and the over etching of the hole
  • It inspects the residual amount of resin on the bottom of the hole
  • It inspects the line width and thickness of several ㎛ as well as the wiring defects

C. COK(Change Of Kit)

It examines the appearance of semiconductor COK to check its defects

Feature

  • It inspects the pin height, pusher head height by type, thickness, foreign matter and damage of COK
  • It can inspect external defects with the size of tens ㎛ using a high-speed optical system